飞机尾喷流对舰面温度场影响仿真分析

Numerical study of carrier gound temperature field under influence of aircraft jet flow

  • 摘要: 本文针对舰载飞机舰面起飞过程中尾喷流冲击偏流板形成的回流温度场和偏流板板后的温升情况开展了仿真计算和参数影响规律研究。首先,设计了一个双发大推力的舰载机模型,并通过跟台架试验结果对比,验证了采用k-ε湍流模型的计算流体力学(Computational Fluid Dynamics, CFD)方法对喷流速度场和回流速度场模拟的准确性。然后,通过控制变量的方法研究了喷管轴线角度、喷管间距、喷管扩张比对进气道出口温度畸变强度和偏流板后温度场的影响规律,发现:适当增加喷管轴线上翘角度或者是增加喷管间距可以有效抑制进气道吸入高温回流、降低板后舰面温度场极值,当双发喷管间距增加到3倍喷管喉道直径时进气道出口温升几乎为0。最后,从偏流板的改进设计出发,在不增加舰面额外设备的前提下,研究了偏流板表面横向开槽对偏流板引射能力的影响,结果表明偏流板表面横向开槽可以增强尾喷流的周向引射能力,有效降低回流温度场的强度。

     

    Abstract: This study conducted numerical simulations and parameter studies on the reflux temperature field and the temperature rise after the jet blast deflector (JBD) plate caused by the impact of the wake jet of carrier based aircraft during the takeoff process. Firstly, an aircraft model with twin high-thrust engines was designed, and the accuracy of the computational fluid dynamic (CFD) simulation using the k-epsilon turbulence model in calculating the jet and reflux velocity fields was verified through comparison with the wind tunnel test data. Then, by controlling variables, influences of the nozzle axis angle, nozzle spacing, and nozzle expansion angle on the temperature distortion intensity at the exit of the inlet and the total temperature field behind the JBD were studied. It is found that, increasing the upward tilting angle of the nozzle axis or increasing the nozzle spacing can effectively reduce the intake of high temperature reflux and the extreme values of the temperature field behind the JBD; when the nozzle spacing increases to three times the nozzle throat diameter, the temperature rise at the exit of the inlet is almost zero. Finally, to improve the JBD design, without adding additional equipment on the ship surface, the effect of transverse slotting on the JBD’s flow guiding ability was studied, which suggests that transverse slotting on the JBD surface can enhance the circumferential injection ability of the wake jet and effectively reduce the intensity of the reflux temperature field.

     

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